热喷涂用Ni/WC金属陶瓷粉的化学镀制备

Ni/WC POWER PREPARED BY ELECTROLESS PLATING FOR THERMAL SPRAYING

对非金属化学镀镍活化方法的研究进行了概述,提出了以盐为活化剂的直接活化新工艺.采用这种活化法,首先在碳化钨颗粒表面吸附上具有催化活性的Cl-,然后进行化学镀镍,得到均匀、致密、完整的Ni-P合金包覆层,并对镀镍合金层成分进行了能谱分析以及镀覆层形貌进行扫描电镜观察.结果表明,镀覆层除镍、磷元素外,实验过程中未引入杂质元素,镀层为典型的低磷层形貌.

We study the activation process of electroless nickel plating on nonmetal, putting forward a kind of direct activation process: NaCl dipping. In this present work, using this direct activation process, WC covered with Ni-P alloy coatings was obtained. First, activation ions Cl^- were absorbed on the surface of WC and then electroless nickel plating happened. The coating was uniformity, compacted and integritd. The compositions of deposited coatings were analyzed with Energy Dispersive X-ray Detector (EDX) and the morphology of deposited coatings was observed by scaning electron microscope (SEM). As the results showed, there were only Ni and P elements on deposited coatings, and the typical morphology of the coatings was low phosphorus coatings.