添加剂对盐基胶体钯活性和稳定性的影响

Effect of Additives on Activity and Stability of Salt-Based Colloid Palladium

为了研究添加剂对盐基胶体钯多种性能的影响 ,成功地制备了盐基胶体钯。研究发现 ,抗坏血酸能大大增加盐基胶体钯的稳定性 ;香草醛能显著增加试片表面钯含量 ;甲醇使盐基胶体钯活性和稳定性均有所下降 ;对苯二酚对盐基胶体钯活性和稳定性无明显影响。结果表明 ,加入添加剂可提高盐基胶体钯的活性和稳定性 ,可提高其使用性能。试片上钯含量越高 ,化学镀铜引发周期越短 ,当活化液浓度 (以PdCl2 计 )为 0 .1g/L时 ,引发周期≤ 10s。激光粒度仪测得盐基胶体钯粒径为 78～ 10 4nm。

Additives can improve the activity and stability of salt-based colloid palladium, and increase its service performance. Salt-based colloid palladium with high ac- tivity and high stability was prepared successfully, and the effects of ascorbic acid, methanol, hydroquinone and vanillin were stud- ied. Ascorbic acid can greatly increase the stability of salt- based colloid palladium, and vanillin can obviously raise the Pd content on the substrate surface. Methanol decreases the activity and sta- bility of salt- based colloid palladium, and hydroquinone has less effect. The higher the Pd content of substrate is, the less the ini- tiation time of electroless copper plating is. The initiation time is less than or equal to 10 seconds when the concentration of colloid palladium activation solution is O. 1 g/L PdCl_2. The particle sizes of salt- based colloid palladium are among 78 ～ 104 nm measured by laser particle size analyzer