两种微波铁氧体粘接材料的导热分析与比较

Analysis on Heat Conductivity and Comparison of Two Adhesive Materials for Microwave Ferrite Devices

缩醛烘干胶和焊锡是微波铁氧体器件中常用的两种粘接材料,用于铁氧体片在器件壳体内壁既定位置上的固定。本文以一种高功率四端环行器为例,在不考虑热辐射和微波反射损耗的前提下,分别对胶层和焊锡层在热平衡时的导热情况进行了分析,并且比较了它们的优缺点。

Shrinked aldehyde drying glue and soldering tin is two kinds of adhesive materials used for adhibiting and fixing the pieces of ferrite on the inner wall of the shell of microwave ferrite devices. Taking a high power 4-port circulator as an example, on the premise that no thermal radiation and microwave reflection loss are concerned, this article analyses heat conductivity of glue stratum and soldering tin stratum at thermal balance, and compares their advantages and disadvantages.