Pyrex玻璃的湿法刻蚀研究

Wet Etching of Pyrex Glass

对Pyrex7740玻璃的湿法刻蚀工艺进行了研究。实验中采用了几种不同的材料(光刻胶、Cr/Au、TiW/Au)作为刻蚀玻璃的掩膜,通过实验发现TiW/Au掩膜相对目前比较常用的Cr/Au掩膜有很多优点,如减少了玻璃的横向腐蚀,增加了深宽比,刻蚀图形边缘更加平滑等。还研究了腐蚀液成分配比对刻蚀结果的影响,发现刻蚀速率随HF浓度的增加而增加,且在HF浓度一定时,加入少量HNO3可以明显提高刻蚀速率。本文的实验结果对一些MEMS器件特别是微流体器件的制作有一定参考作用。

The deep wet etching of Pyrex 7740 glass is investigated. Several different materials (photoresist, Cr/Au and TiW/Au) are used as etching mask in the experiment.The results show that TiW/Au is more appropriate to be used as etching mask than Cr/Au.The TiW/Au,as etching mask,has some advantages such as lower lateral etching speed, higher aspect ratio and smoother edge. Different solutions are used to etch the glass and the results show that the etching rate is proportional to the concentration of HF in the solution and at the same concentration of HF etching rate can be obviously increased by adding some HNO_3 in the solution. These experiment results can be used in the fabrication of some MEMS device, especially some micro fluid devices.