摘要
化学镀铜在工业上的应用范围日益扩大,最主要的应用领域是电子工业,如印制线路板的通孔金属化。目前化学镀铜工艺使用的还原剂为甲醛,由于甲醛对人体和环境有害,寻找替代甲醛的新型还原剂已迫在眉睫。本文综述了国内外几种甲醛替代还原剂(次磷酸盐、二甲氨基硼烷(DMAB)、乙醛酸、甲醛-氨基酸、甲醛加成物及Co(Ⅱ)-乙二胺等)的化学镀铜方法,同时简要介绍东硕公司在次磷酸盐作为还原剂化学镀铜方面所作的研究。
The application of electroless copper plating is widely used in the industrial field, especially in electronindustry, such as the production of PCB through-hole metallization. At present, the reducing agent used in electrolesscopper plating is formaldehyde. It is well known that formaldehyde is harmful to people and entironment . So to replacethe formaldehyde reducing agent becomes urgent. There are some articles which have reported the replacement offormaldehyde as reducing agent, such as hypophosphite, DMAB, glyoxylic acid, formaldehyde-glycine , formalde-hyde-addition compound, Co(Ⅱ)-Ethyldiamine and so on. At the same time, we are doing research about thehypophosphite as the reducing agent.
出处
《印制电路信息》
2004年第12期31-34,70,共5页
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