期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

基于复合基底微机械微带特性研究

Study of Complex Substrate MEMS Microstrip
下载PDF
导出
摘要 研究了一种复合基底微机械微带,通过理论推导得出微机械微带的特性计算表达式。首先用计算机模拟该微机械微带的性能,再用表面微细加工工艺加工了该微机械微带模型,最后用安捷伦矢量网络分析仪器测试模型,得出该微带在100GHz内无色散,最大损耗小于2dB。该微机械微带利于集成、尺度微小,可应用在微波、毫米波通信系统(器件)中,克服了常规微带在高频工作时色散严重、损耗大等缺点。 A complex substrate MEMS (Micro-Electro-Mechanical-Systems) microstrip was studied, and formulas of MEMS microstrip performance were got by electromagnetism theoretic. A good analysis method of MEMS microstrip was obtained. The good performance of MEMS microstrip was showed by HFSS software simulation, and the MEMS microstrip model was fabricated by surface micromachining technics. The model of MEMS microstrip was measured by Agilent PNA—L vector network analysis instrument. It has a little dispersive infection within 100 GHz,and attenuation is not better than 2 dB. The MEMS microstrip has integration, minisize characteristics, and is used in the microwave and millimeter -wave wireless communication devices(systems).The high-dispersive and high-attenuation are resolved in normal microstrip.
作者 赵继德 李应良 马传龙
机构地区 烟台师范学院物理与电子工程学院 华信邮电咨询设计研究院有限公司 重庆通信学院
出处 《电子元件与材料》 CAS CSCD 北大核心 2005年第1期49-52,共4页 Electronic Components And Materials
基金 澳大利亚国家自然科学基金资助项目(No.200230150019) 高校青年教师基金资助项目
关键词 电子技术 微机械 复合基底 微带线 electronic technology MEMS complex substrate microstrip
分类号 TN405 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献12

  • 1李应良,潘武.射频系统中MEMS谐振器和滤波器[J].光学精密工程,2004,12(1):47-54. 被引量：16
  • 2Chi C Y. Planar microwave and millimeter-wave lumped elements and coupled-line filtersusing micro-machining techniques [D]. Ph. D Dissertation, Radiation Laboratory, University of Michigan, 1995.
  • 3Weller. High microshield line components [J]. IEEE Trans Microwave Theory Tech, 1996, 44(3): 534-543.
  • 4Milovanovic B, Markovic V. High frequency circuits manufactured by micromachining techniques [P]. Proc 21st Int Conf Microelectronics, Nish,Yugoslavia, 1997, (9): 523-526.
  • 5Park K Y, CHOI H K. A novel Ka-band bandpass filter using LIGA micromachined process [C]. Microwave Conference, 2000 Asia-Pacific,2000. 1306-1309.
  • 6Heiliger H M, Ngel M. Thin-film microstrip lines for mm and sub-mm-wave on-chip interconnects [C]. IEEE MTT-S Int. microwave Symp Dig, 1997. 421-424.
  • 7Frank Schnieder, Wolfguang Heinrich. Model of thin-film microstrip line for circuit design [J]. IEEE Trans Microwave theory tech, 2001, 49(1):104-110.
  • 8Hoffmanm P K. Integrierte Mikrowellenschaltungen [M]. Bernlin,Germanv: Spring-Verlag, 1983. 160-170.
  • 9Milovanovic B, Markovic V. High frequency circuits manufactured by micromachining techniques [P]. Proc 21st Int Conf Microelectronics, Nish, Yugoslavia, 1997, (9): 523-526.
  • 10Park K Y, CHOI H K. A novel Ka-band bandpass filter using LIGA micromachined process [C]. Microwave Conference, 2000 Asia-Pacific, 2000. 1306-1309.

二级参考文献22

  • 1Yong-Kweon. RF MEMS and applications[J]. Microwave Journal,2002,(3):4-48.
  • 2NGUYEN C T C. Micromechanical components for miniaturized low-power communications[C]. Proceedings, 1999 IEEE MTT-S International Microwave Symposium RF MEMS Workshop Anaheim, California, 1999,18: 48-77.
  • 3HANE K.Silicon optical MEMS:optical components and sensors[J].光学精密工程,2002,10(6):632-633.HANE K.Silicon optical MEMS:optical components and sensors[J].Optical and Precision Engineering,2002,10(6):632-633. (in Chinese)
  • 4TANG W C, NGUYEN T H, HOWE R T. Laterally driven polysilicon resonant microstructures [J]. Sensors and Actuators A, 1989(20): 25-32.
  • 5NGUYEN C T C. Micromechanical resonators for oscillators and filters[C], Proceedings of 1995 IEEE International Ultrasonics Symposium, Seattle, 1995,7-10:489-496.
  • 6TSU W T, CLARK J R, NGUYEN C T C. Q-optimized lateral free-free beam micromechanical resonators[C],Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers 01), Munich, Germany, 2001,(6):1110-1113.
  • 7NGUYEN C T C. Communications applications of microelectromechanical systems[C], 1998 Sensors Expo,San Jose, CA, 1998,(5): 447-455.
  • 8STICKEL M, ELEFTHERIADES G V, KREMER P. A high-Q bulk micromachined silicon cavity resonator at Ka-band[C], Electronics Letters 29th, 2001,(3):433-435.
  • 9GROEJB LARSONLE 杨家玮.CDMA无线电设计[M].北京:人民邮电出版社,2002(8).130-133.
  • 10CLARK J R, WONG A C, NGUYEN C T C. Parallel-resonator HF micromechanical bandpass filters[C],Digest of Technical Papers,1997 International Conference on Solid-State Sensors and Actuators, Chicago, Illinois, 1997,(6): 1161-1164.

共引文献15

电子元件与材料
2005年 第1期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部