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金属型预热温度对微连接用铸造SnAgCu钎料合金性能影响 被引量:5

Effect of Preheating Temperature of Permanent Mould on the Properties of Microjoining SnAgCu Solder Cast Alloy
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摘要 对不同金属型预热温度下铸造Sn-2.0Ag-0.7Cu钎料合金的力学性能、物理性能及润湿性与传统Sn-37Pb钎料进行了对比研究。试验结果表明:较快的冷却速度使Sn-2.0Ag-0.7Cu钎料合金具有较高的抗拉强度和伸长率,较窄的固-液相线温度区间,合金的润湿性有所改善,但电导率变化不大。 The mechanical properties, physical properties and wettability of Sn-2.0Ag-0.7Cu solder alloys cast by permanent mould with different preheating temperature were investigated, and were compared with traditional Sn-37Pb solder. The results show that the rapider cooling rate can contribute to the higher tensile strength and the better elongation of Sn-2.0Ag-0.7Cu solder, and the narrower range of the solidus-liquidus temperature. The wettability is also improved to some degree, but the conductivity doesn′t change greatly.
出处 《热加工工艺》 CSCD 北大核心 2004年第11期45-47,共3页 Hot Working Technology
基金 河南省高校杰出科研人才创新工程资助项目(2004KYCX020) 河南省青年骨干教师资助项目(20002114)
关键词 无铅钎料 力学性能 物理性能 润湿性 lead-free solder mechanical property physical property wettability
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参考文献5

  • 1Guo F, Lucas J P,Subramanian K N .Creep Behavior in Cu and Ag Particle-reinforced Composite and Eutectic Sn-305Ag and Sn-4.0Ag-0.5Cu non-composite Solder Joints[J]. Journal of Materials Science,2001,12:27-35.
  • 2Chada S,Fournelle R A,Laub W. Copper Substrate Dissolution in Eutectic Sn-Ag Solder and Its Effect on Microstructure[J]. Journal of Electronic Materials,2000,29(10):1214-1221.
  • 3Asnerson IE. Development of Eutectic and Near-eutectic Tin-Silver-Copper Solder Alloys for Lead-free Joining Applications [A]. International Brazing & Soldering Conference Proceedings [C]. New Mecxico:2000.575-586.
  • 4Seok-Huh, Keun-Soo Kim , Katsuaki Suganuma. Effect of Ag on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder [J]. Materials Transactions, 2001, 42 (5):741-748.
  • 5Moon K W, Boettinger W J,Kattner U R, et al. Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys [J]. Journal of Electronic Materials,2000,29 (10):1122-1136.

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