无氰碱性镀铜

Non-cyanide alkaline copper plating

采用柠檬酸铜为主盐,加入氢氧化钾和合适的光亮剂,配制出一种无氰碱性镀铜液。通过赫尔槽试验确定其合适的电流密度范围为0 5～2A/dm2。分别对该无氰碱性镀铜层在铜基体、铝合金基体、锌合金基体上以及以该镀层作为镀铬层的底层时的结合力进行了测定,表明该镀铜层的结合力较好。测定该镀铜的沉积速率、电流效率、极化曲线以及镀液稳定性的结果表明,该无氰镀铜的电流效率与沉积速率都较高,极化度优于焦磷酸盐镀铜,且该镀液的稳定性较好。

A kind of non-cyanide alkaline copper plating bath was prepared with copper citrate as main salt and by adding potassium hydrate and suitable brightener into the bath. The optimal current density obtained by Hull Cell test was 0.5～2 A/dm^2. The adhesion of the copper deposits was tested when copper, copper alloys and zinc alloys were used as substrates respectively and the copper deposits were used as the bottom layers of Cr deposits. The deposition rate, current efficiency, polarization curves and bath stability of the non-cyanide alkaline copper plating were studied. The results show that both the adhesion of the deposits and the bath stability are satisfactory, and the deposition rate and current efficiency are high. Moreover, the polarizability of the non-cyanide alkaline copper plating is superior to that of pyrophosphate salt copper plating.