摘要
对高性能热接口材料进行了研究。分析了材料的导热系数、击穿电压、拉伸强度等性能的变化关系,并对其变化趋势进行了探讨。最终给出了该类热接口材料的半定量配比及性能指标。
The study of one of the thermal interface materials filled with copper pwoder was presented .The relationships between the filler volume of the special copper powder and the properties of the thermal conductivity,puncture voltage and dielectric strength and tensile strength,and their changing progress were addressed,Finally the semi-quantitative composition and the material's typical datas were given.
出处
《特种橡胶制品》
2004年第6期24-26,共3页
Special Purpose Rubber Products
关键词
热接口材料
硅橡胶
导热系数
thermal interface material,silicone rubber,thermal conductivity
