SMT中再流焊工艺建模与仿真

Modeling and simulating of reflow soldering in SMT

主要介绍了国内外再流焊工艺建模与仿真研究现状。目前主要是焊点建模与仿真、元器件建模与仿真以及再流焊工艺建模与仿真方面。本文还重点介绍了再流焊工艺建模与仿真的几种方法,并对再流焊工艺建模与仿真存在的问题以及发展前景做了分析。

The recent work about the modeling and simulating of reflow soldering process home and abroad are introduced in the paper. The research concentrates on the modeling and simulating of solder joint and components. Some methods are described emphasizely. The difficulty of the modeling and simulating of reflow soldering process is analyzed. The trend is also forecasted.