摘要
功能性镀层和精密电镀技术在半导体微电子产业当中应用十分广泛,且随着半导体集成电路向高密度、轻小型化发展,各种新型功能性电镀技术将会不断涌现。举出了功能镀层及精密镀层在电子封装中的应用实例。简要介绍了BGA型封装中的电镀技术。系统地介绍了电子封装中所涉及的各种电子电镀技术,并阐述了IC引线框架及无铅化电镀技术方面的应用情况、存在问题及今后的发展趋势。
Functional coatings and precise electroplating technology are widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, various new functional electroplating technologies will come forth constantly. The application examples of functional coatings and precise coatings in electronic packages were listed. The electroplating techniques in BGA packaging were briefly introduced. Various electronic electroplating technology in electronic packaging were systematically discussed. Moreover, the applications, existing problems and development trends of IC lead-frame and lead-free electroplating technology were illustrated.
出处
《电镀与涂饰》
CAS
CSCD
2005年第1期44-49,共6页
Electroplating & Finishing
关键词
电子封装
引线框架
电镀
功能镀层
精密镀层
无铅化技术
electronic packaging
lead-frame
electroplating
functional coating
precise coating
lead-free technology
