摘要
MEMS功能主要通过微结构部件的微小位移和变形实现,故其动态性能测试至关重要,但MEMS结构由于其尺寸小,传统的动态测试方法已经难以达到要求,而光学测试技术是非接触测量,且具有定位准确、测试精度高、响应快的特点,使其在MEMS结构动态测试中发挥着越来越重要的作用。介绍并分析了频闪显微干涉、计算机微视觉、激光多普勒测振、电子散斑干涉和光纤测试等MEMS动态测试技术,讨论了其应用场合和测试范围。
Effective and reliable manufacturing of Micro-Electro-Mechanical Systems (MEMS) requires extensive measurements of their mechanical and material parameters including shape, displacements, deformation, vibration mode profiles and material constants. Knowledge of these parameters at various technological and product life stages is of fundamental importance for MEMS design process. Since the small size of microstructure in MEMS, the traditional testing method cannot fulfill the task. Thus a non-contacting and non-perturbative testing is needed. Optical testing methods have many merits such as non-contact, quickness, high precision and rapid response and it becomes the main testing method of MEMS. Applications of optical testing methods for MEMS testing, such as stroboscopic microscopic interferometry, computer-micro-vision system, laser-Doppler vibrometer, electronic speckle pattern interferometry (ESPD and fiber optic interferometry, were described and discussed.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2005年第1期83-88,共6页
China Mechanical Engineering
基金
辽宁省自然科学基金资助项目(20032131)
