摘要
通过对两种混合集成电路即温控电路及隔离放大器BB3656BC的失效分析,表明以下观点:(1)对混合集成电路的分析,应通过电路內部测试,测量电路工作状态下各个关键部位的参数乃至动态波形;(2)深入的分析过程有利于对电路透彻的了解及促进同类型电路分析的深度,有利于使分析结论更趋准确。
Through the analysis of failure of two integrated circuits (ie, temperature controlling circuit and isolated-amplifier BB3656BG), following viewpoints are shown: (1 )The parameter and dynamic waveform about key location must be measured through internal test when the circuit is working; (2) Detailed analysis benefits understanding the circuit accurately and the analysis conclusion can be more accurate.
出处
《电子元器件应用》
2001年第11期35-38,共4页
Electronic Component & Device Applications
关键词
混合集成电路
应用
失效分析
Hybrid integrated circuits
Failure analysis