摘要
对 10 0mmIn0 .49Ga0 .51P/GaAsHBT器件及相关电路制备中的In0 .49Ga0 .51P腐蚀问题、聚酰亚胺平面化、空气桥等几项关键工艺进行了研究 ,解决了器件及电路制备过程中出现的难题 ,尤其是用很简单的方法解决了In0 .49 Ga0 .51P腐蚀过程中经常出现的腐蚀“岛”问题 。
The key process-InGaP etching,polymide planarization process,and air-bridge for fabrication of self-aligned InGaP/GaAs HBT devices and circuits are studied.The problems,especially the formation of the “island” nearby the emitter contact during the etching of InGaP,are resolved.InGaP/GaAs HBT devices and circuits with good performances have been obtained.
基金
国家重点基础研究发展计划资助项目 (批准号 :G2 0 0 0 0 683 0 40 3 )~~