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100mm InGaP/GaAs HBT及相关电路关键工艺 被引量:1

Key Processes for Fabrication of Self-Aligned InGaP/GaAs HBT Device and Circuit
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摘要 对 10 0mmIn0 .49Ga0 .51P/GaAsHBT器件及相关电路制备中的In0 .49Ga0 .51P腐蚀问题、聚酰亚胺平面化、空气桥等几项关键工艺进行了研究 ,解决了器件及电路制备过程中出现的难题 ,尤其是用很简单的方法解决了In0 .49 Ga0 .51P腐蚀过程中经常出现的腐蚀“岛”问题 。 The key process-InGaP etching,polymide planarization process,and air-bridge for fabrication of self-aligned InGaP/GaAs HBT devices and circuits are studied.The problems,especially the formation of the “island” nearby the emitter contact during the etching of InGaP,are resolved.InGaP/GaAs HBT devices and circuits with good performances have been obtained.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第1期106-110,共5页 半导体学报(英文版)
基金 国家重点基础研究发展计划资助项目 (批准号 :G2 0 0 0 0 683 0 40 3 )~~
关键词 In0.49Ga0.51P腐蚀 聚酰亚胺平面化 空气桥 island formation polymide planarization process air-bridge
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参考文献5

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同被引文献11

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