铜化学机械抛光中电化学理论的应用研究

Applied Study of Electrochemistry Theory on the Copper Chemical-mechanical Polishing

概述了电位 pH图、极化曲线、交流阻抗谱和开路电压测试等电化学方法在铜化学机械抛光 (Cu- CMP) 中的应用, 并分析了采用电化学方法进行CMP分析存在的问题, 指出采用以上电化学方法进行Cu -CMP分析有利于对Cu- CMP的过程的理解, 并可以为抛光液组分的选配提供依据。

The electrochemical methods such as potential-pH diagram, polarization curves, electrochemical impedance spectroscopy (EIS) and open circuit potential (OCP) applied on the chemical-mechanical polishing of copper (Cu-CMP) were summarized, and the defect of those methods on the Cu-CMP were also analyzed. It is pointed out that it is helpful to realize the process of Cu-CMP, and select the constitute of slurry by adopting the electrochemical methods described above.