摘要
对粉末冶金熔渗技术制备的不同成分W Cu合金在 - 196℃ ,保温 4 8h进行深冷处理。采用X射线衍射仪和透射电子显微镜分析长时间深冷处理的现象与机理。结果表明 :深冷处理后铜颗粒以短棒状形态在钨基体上弥散析出。析出的细小弥散的铜颗粒阻碍晶粒粗化和位错移动 ,铜颗粒部分填充到材料微孔内 ,同时深冷处理过程中的体积收缩也使材料内的部分缺陷如空位和微孔得到弥合 ,从而使不同成分的W Cu合金的硬度提高 ,密度增大 ,电导率降低。
W-Cu alloys prepared by powder metallurgy infiltration method were treated at -196°C for 48 h. The phenomenon and mechanism of cryogenic treatment were studied by X-ray diffraction and transmission electron microscopy. The results show that the copper phase precipitate dispersively on tungsten body and appear short or coarse structure after cryogenic treatment. The fine-dispersion copper particle can restrain grain coarse and dislocation moving and fill in pores of W/Cu materials. Moreover, the volume constriction can repair part defects of W/Cu materials during cryogenic treatment. The hardness and density of W/Cu alloys improve and its conductivity decrease after cryogenic treatment.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2004年第6期44-47,共4页
Transactions of Materials and Heat Treatment
基金
陕西省教育厅专项基金项目 ((0 2JK1 31 1 )
关键词
W-Cu合金
深冷处理
沉淀析出
Copper alloys
Cryogenics
Electric conductivity
Hardness
Mechanical properties
Metallographic microstructure
Powder metallurgy
Precipitation (chemical)
Transmission electron microscopy
X ray diffraction analysis
