摘要
电子产品朝更轻、更薄、更快方向发展的趋势,使印制板在高密度互连技术上面临挑战。微堆叠孔技术是一种用来产生高密度互连的方法。通常树脂、导电胶和电镀铜都可以用来进行填孔,比较其它的方法,电镀填孔技术工艺流程短、可靠性高,该文讨论不同电镀设备、操作条件和添加剂条件对填孔效果的影响。
The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporated high density interconnection technology. Micro stacked via is one technology utilized to produce high-density structures. dielectric resin, conductive paste or via plating are usually applied for the filling process .As compare with other filling method, via filing plating technology has advantage in offering a shorter process and higher reliability ,this paper discuses the influence of different equipment design ,oper- ating conditions and additives on via filling plating technology.
出处
《印制电路信息》
2005年第2期32-36,共5页
Printed Circuit Information
