HDI填胶工艺的研究

Study of Resin Filling Technology on HDI

适应于电子产品高性能化、多功能化和高可靠性,电子封装元器件的微型、轻巧化以及3-D安装方法的广泛采用,多阶HDI精细线路制作的需要,HDI制作过程中对PCB基板的尺寸稳定性及板面平整度要求提高,要求各阶段PCB板面凹凸差<5μm。该文在对常规HDI制作工艺进行研究的基础上,通过HDI填胶、除胶工艺的制作的采用,介绍了一种确保HDI制作工艺满足板面平整性的要求的工艺制作方法,以达到HDI精密制作、封装的需要,制作出符合精密制作、封装要求的HDI板件。

Adapted electronic production to high skill and reliability, more function, it is getting more and more miniature and legerity for electronic packaging parts so that 3-Dfixing means can be introduced abroad. In order to manufacture fine circuit on multi-layer HDI, size stability of base board and surface planarization of PCB is enhanced in manufacturing process of HDI, and the dispatch of concave and protruding side on board must be under 5μm in each manufacturing stage of PCB. On the basis of study of manufacturing technology for general HDI, a craft-manufacturing method whose surface planarization on board can satisfy the demand of manufacturing HDI is introduced in this paper in order to manufacture fine HDI and pack electronic parts through adopting of filling and removing resin in manufac- turing HDI, then HDI according with fine facture and requirement of package may be produced by this mean.