铋对阴极铜沉积微观结构的影响

THE EFFECT OF BISMUTH ON MICROSTRUCTURE OF THE CATHODIC COPPER DEPOSITION

文章用扫描电镜、Ｘ射线衍射仪、原子吸收光度计和Ｘ射线色散能谱等仪器，研究了含有铋离子的酸性硫酸铜电解液中阴极铜沉积的电结晶生长形态、结晶的晶面取向以及铜沉积层的化学组成。研究结果表明：６０℃时在通常的电解电流密度ｉ＝２００Ａ·ｍ－２下电解，铋不会在阴极沉积；铋离子对铜沉积层的晶面择优取向（２２０）基本不影响，高浓度铋离子存在于电解液中时对（２２０）晶面生长起促进作用，对其它晶面生长起较强的抑制作用；铋离子影响铜沉积的电结晶生长形态和铜沉积层的晶胞尺寸。

In this paper,we studied the electrocrystal formation,crystal orientation and the chemical composition of the cathodic copper deposition with the presence of Bi^3+ in the electrolyte of acidified CuSO4 by using scan electron microscopy,Xray diffraction,atomic absorption and EDAX.The results indicate that Bi couldn't deposit on cathode when copper electrolysed at common current density i=200A·m-2and t=60℃.Bi~3+ scarcely effected on the predominant crystal orientation(220) of copper deposition,high concentration Bi^3+ in the electrolyte promoted (220) growth and inhibited the other crysted orientation deposition.Bi^3+ effected on electrocrystal formation and the cell diemension of copper deposition.