ECR等离子体溅射法制备纳米金属薄膜

NANO—SIZED METAL FILMS DEPOSITED BY ECR PLASMA SPUTTERING METHOD

本工作用电子回旋共振(ECR)等离子体溅射方法,选取各种不同结构的纯金属圆筒靶材料:Ti(hcp),Au(fcc),cu(fcc),Mo(bcc),Sn(四面体),在室温基片上沉积出各种金属薄膜,基体为玻璃、NaCI单晶.用XRD的物相分析与线形分析和TEM形貌观察与电子衍射,确定了Ti、Au、Cu薄膜都是纳米晶粒(a<10nm)组成的fcc结构多晶膜.用TEM的形貌观察与电子衍射确定了Mo、Sn膜为非晶结构的薄膜,Mo膜的非晶结构比较稳定,sn膜的非晶结构很不稳定,在TEM的电子束照射下迅速晶化并成核长大.本文讨论了溅射成膜过程对膜的结构和粒径的影响.

All kinds of metal films (Ti, Au, Cu, Sn, Mo) have been manufactoried by use of a sputtering deposition utilizing Electron Cyclotron Resonance (ECR) plasma at room temperature, and the cyclindrical targets with different structure are selected. The results of XRD as well as TEM show that Ti, Au. Cu films consist of nano-crystal particles with the average grain size d<10nm and the structure of them are fcc. The results of TEM show that the Mo, Sn films are amorphous films. The amorphous structure is stable in Mo films and is not stable in Sn films which can produce nucleus and grow up rapidly in the electron beam of TEM. In this paper, the influence of sputtering progress on structure and grain size of the films have been discussed.