摘要
利用机械合金化工艺制备了颗粒尺寸为0.5μm、W晶粒尺寸为10nm的纳米晶W-Cu粉末,研究了其烧结致密化行为、烧结合金显微组织及其性能,并考察了其晶粒长大特性。结果表明:烧结温度和时间的增加有利于致密化,1300℃烧结30min,合金取得了99%的相对密度;硬度随烧结温度、时间的增加而增加,在1375℃烧结30min,硬度为HB321。W晶粒随着烧结温度的升高而增大,1200℃烧结30min获得了相对密度为98%以上、硬度为HB264、晶粒尺寸约为350nm的细晶W-Cu合金。
Sintering behavior 、microscopic and property of nano-grained W-15Cu composite powders with particle size 0.5 μm 、W grain size 10～20nm prepared by mechanical alloying was studied, and the grain growth characteristic was investigated . The results show that sintering densification and hardness of sintering compact rises with the increment of sintering temperature and time, the relative density of 99% and hardness HB321 were acquired respectively at 1 300 ℃/30 min and 1 375 ℃/30 min . W grain gradually coarsen with the increment of sintering temperature, fine grain W-Cu alloy with relative density 98%,hardness HB264,W grain size 350 nm was obtained at 1 200 ℃/30 min.
出处
《中国钼业》
2004年第6期36-40,共5页
China Molybdenum Industry
