摘要
利用电阻率变化分析了Cu-Ni-Si合金时效析出机制。发现该合金固溶后在低温时效初期按调幅分解机制析 出;而在高温时效时则直接以形核长大方式析出。合金在450℃时效时经历的三个贯序为:溶质富集区一半共格Ni2Si相 一非共格Ni2Si相。计算与透射电镜观察表明,维持与基体半共格界面的析出物最大临界直径约12 nm。
The precipitation mechanism of Cu - Ni - Si alloy during aging was analysed by use of resistivity. It was found that the precipitation mechanism was spinoda] decomposition at the begining of aging when aging at low temperature, while that was nucle ation and growth when aging at high temperature after solution heat treatment. The alloyexperienced three sequences when aging at 450 ℃, which was solute - rich - zone, semi - coherent Ni2Si precipitate and non - coherent Ni2Si precipitate. Calculation and TEM observation show that the maximum diameter of precipitate is 12 nm, which can keep coherent boundary with matrix.
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2005年第1期25-28,共4页
Ordnance Material Science and Engineering
基金
国家自然基金资助项目(50071026)
