工程陶瓷磨屑形成机理及磨削模型

STUDY OF CHIP FORMATION MECHANISMS IN ENGINEERING CERAMICS GRINDING & THE ESTABLISHMENT OF GRINDING MODEL

从单颗金刚石磨料磨削工程陶瓷材料的试验入手,用扫描电镜观察陶瓷磨痕形貌,对陶瓷磨屑形成过程的表面裂纹、塑性变形及重结晶机制进行分析。提出工程陶瓷的磨削模型可划分为3个变形区:脆性崩碎区,非弹性变形区和残留破坏区。磨削过程为3个阶段:弹性变形及有限非弹性变形阶段、裂纹生长及扩展阶段和切屑形成阶段。

Single-point diamond abrasive grinding experiments on engineering ceramics were carried out and the topography of the scratched grooves were observed with a SEM. The surface crack, plastic deformation and recrystallization occurring in engineering ceramics grinding process were analysed. The grinding model of ceramics grinding can be described as three regions: brittle fracture, non—elastic deformation and residual damage regions. The processes of grinding includes: elastic and finite plastic deformation, crack growth and crack propagation and chip formation.