摘要
针对在恶劣温度条件下工作的芯片热控制系统问题,基于由微泵、微通道、热电模块、智能控制单元、散热片以及液体管道等构成的微通道对流换热设计思想,数值仿真分析了微通道结构的速度场和压力分布,计算了系统管道、微通道等部件的沿程阻力和局部阻力,给出了换热系统的最佳工况点,确定了系统必需的微泵工作性能参数。
An IC heat exchange control system used in adverse conditions was designed and studied, which is composed of a micropump, a microchannel, a thermal electrical module, an intelligent control system, a heat radiator and a liquid pipes etc.. The structure of microchannel was optimized through the diffusion capacities of the system, and the velocity and pressure distribution in the microchannel were calculated and simulated. The total pressure loss and partial pressure loss of the system pipes and the microchannel were calculated effectively, and the optimum status of the heat exchange control system was defined.
出处
《电子机械工程》
2005年第1期20-21,36,共3页
Electro-Mechanical Engineering
关键词
散热
微通道
微泵
阻力
heat exchange
microchannel
micropump
pressure loss
