摘要
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。研究了固化温度、固化时间及固化剂、纳米SiO2粒子添加量对连接性能的影响。在固化温度为145℃,固化时间为2h时,导电胶连接强度达到20MPa。体系中添加适量的纳米SiO2粒子,连接强度提高到25MPa。SiO2粒子均匀地分散在环氧树脂基体的三维立体网状大分子链中,起到分散应力,吸收冲击能,阻止裂纹扩展的作用。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO_2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145 ℃ for 2 h. The adhesion strength increased to 25 MPa when the SiO_2 nano-particles were doped. This result is attributed to the fact that SiO_2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2005年第1期225-228,共4页
Polymer Materials Science & Engineering
关键词
导电胶
纳米粒子
连接强度
conductive adhesive
nano-particles
adhesion strength
