陶瓷改性酚醛树脂粘结剂的耐高温性能

High-temperature Bonding Properties of Phenol-formaldehyde Resin Modified by Ceramic Particles

以酚醛树脂为基体,以碳化硼和硅粉为改性添加剂制备高温粘结剂,并对石墨材料进行粘接,测试了不同温度热处理后的抗剪强度。结果表明:碳化硼改性酚醛树脂粘结剂对石墨材料具有较好的粘接强度,1500℃处理后的粘接强度达到8.6～11.2MPa,但高温热处理后的粘接界面上仍可见到较明显的收缩现象,粘接性能有进一步提高的余地。

The high temperature adhesives were prepared using phenol-formaldehyde (PF) resin as matrix. Boron carbide (B_4C) or silicon (Si) was added as additives to modify the properties of adhesives. Graphite materials were bonded by the above adhesives and treated at different high temperatures. The joining shear strength was tested at room temperature. Results show that the high temperature adhesive composing of PF resin and B_4C has satisfying properties for graphite bonding. The bonding strength is 8.6～11.2MPa when the treatment temperature reached 1500℃. But obvious volume shrinkage still can be found on the bonding interface after being treated at high temperatures and the joining strength can be improved further.