摘要
采用溶胶凝胶和等离子喷涂的方法 ,制备了SUS4 30 La0 .8Sr0 .2 MnO3复合连接板材料。通过TG、IR和XRD分析了La0 .8Sr0 .2 MnO3凝胶烧结过程 ;采用SEM、四探针法和氧化增重法分别研究了SUS4 30 La0 .8Sr0 .2 MnO3复合连接板材料的形貌、电子导电能力和高温抗氧蚀能力。经比较研究发现 ,溶胶凝胶和等离子喷涂都可以制备出高性能的SUS4 30 La0 .8Sr0 .2 MnO3复合连接板材料 ,陶瓷涂层致密度分别达到了 94 .6 %和 97% ;且腐蚀速率由SUS4 30材料的10 4 .93μg2 ·cm- 4·h- 1 分别降低到 2 6 .91μg2 ·cm- 4·h- 1 和 2 0 .39μg2 ·cm- 4·h- 1 ,在 80 0°C下它们的电导率分别为 11.17s·cm- 1和 12 .6 6s·cm- 1 。
SUS430/ La_ 0.8Sr_ 0.2MnO_3 composite interconnector for IT-SOFCs was prepared by plasma spray and Sol-Gel method. The forming process of La_ 0.8Sr_ 0.2MnO_3 perovskite phase material has been investigated by TG, XRD and FT-IR technique. At the same time, the SEM micrography, electronic conductivity and high temperature oxidation corrosion resistance have been studied. The SEM showed that the densification of LSM coating is about 97% and 94.6% respectively. Its electronic conductivity at 800 °C is 12.66s·cm -1 and 11.17s·cm -1, and the parabolic rate is 20.39μg2·cm -4·h -1 and 26.91μg2·cm -4·h -1 for plasma spray and sol-gel coating respectively. Comparison with SUS430 without coating, its oxidation corrosion resistance has been improved greatly.
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2005年第1期4-7,共4页
Journal of Materials Science and Engineering
基金
国家 8 63资助项目 (2 0 0 1AA32 30 90 )
华中科技大学国家模具重点实验室开放基金资助项目(0 2 1 5)
