摘要
采用Ti/Cu／Ni中间层对Si3N4陶瓷进行二次部分瞬间液相(PTLP)连接,研究连接工艺参数对Si3N4／Ti/Cu／Ni连接强度的影响,同时研究了连接强度随试验温度的变化规律。结果表明,在该试验条件下,室温连接强度随着二次连接温度的提高和二次保温时间的延长而提高,改变连接工艺参数对Si3N4／Ti/Cu／Ni二次PTLP连接界面反应层厚度无明显影响;连接强度在试验温度400℃时达到最大,随后随试验温度升高,连接强度降低,但在800℃前,其高温强度具有很好的稳定性。
The influence of bonding parameters and testing temperature on bonding strength was studied under double partial transient liquid phase(PTLP) bonding with Si3N4 ceramic using Ti/Cu/Ni inter-layer. The results showed that the bonding strength at room temperature increases with second bonding temperature and second holding time, and bonding parameters have slight influence on thickness of reaction layer in Si3N4/Ti/Cu/Ni interface of double PTLP bonding. The bonding strength was the highest at testing temperature 400°C, and the bonding strength declined when the temperature continued to increase. But the high temperature strength had good stability if the temperature was less than 800 °C.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第2期41-44,共4页
Transactions of The China Welding Institution
基金
江苏省自然科学基金项目(BK2001087)
(BK2003045)
关键词
氮化硅
二次部分瞬间液相连接
连接强度
高温强度
Bond strength (materials)
Copper
High temperature effects
Interfaces (materials)
Nickel
Silicon nitride
Stability
Titanium
