无铅BGA封装可靠性的力学试验与分析

Mechanical Test and Analysis on the Reliability of Lead-Free BGA Packaging

着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响,介绍了BGA 封装的可靠性力学试验(跌落、弯曲试验)及其分析方法。通过对力学试验中失效焊点的分析以及借助A N S Y S 模拟工具,找出引起失效的根本原因,为开发性能更好、高可靠性的无铅材料、改进无铅工艺提供依据。

The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging. And the further failure analysis on failed solder ball can be helpful in finding the root cause, with the use of ANSYS simulation, which will provide a feedback link to the lead-free material selections and processing parameters improving.