含S和N螯合树脂与贵重金属络合的ESCA表征

ESCA CHARACTERIZATION ON COORDINATION OF CHELATING RESIN CONTAINING S,N WITH SOME HEAVY METALS

含>NH、—NH_2、>S配位基树脂与Cu(Ⅱ)、Ag(Ⅰ)、Au(Ⅱ)、Pd(Ⅳ)和Pt(Ⅳ)离子络合时,配位原子S除提供电子形成配价键之外,与这些金属离子络合时都存在着不同程度的反馈键,我们用ESCA对此树脂与这些离子的络合状态进行了表征。结果表明:这些金属离子的络合容量随反馈键数量的增加而增加,而参与络合的N原子总是提供电子对形成配键。

Surface aspects of chelate resin complexed some heavy metal ions have been studied by means of ESCA. It is evident from the results that S-ligand forms the backbonding except for coordinating bonds with Cu(Ⅱ), Ag(Ⅰ), Au(Ⅲ), Pd(Ⅳ) and Pt(Ⅳ)ions. The containing metal ions in the complexes increase with the increasing the number of back-bonding. And N-ligands(>NH,—NH) are all coordinating bonds which ones donate electron pair from N atom pushes in hybridized empty orbitals of metal ions.