器件表面保护用有机硅漆导电机理的探讨

STUDY ON CONDUCTION MECHANISM OF SP FOR ELECTRONIC DEVICE SURFACE PASSIVATION

通过测量不同固化条件下高压硅器件用有机保护材料聚酯改性硅有机漆SP的电阻率随温度变化的规律,并借助于对经各种条件固化后SP的热重、差热分析、红外光谱分析,研讨了它的高温导电机理.实验结果表明,在一定的固化条件下,固化后的材料在高温时具有最高的电阻率,材料中离子输运最弱,并具有较佳微观结构,这时材料的固化温度是210℃.提出了SP的高温电导主要是含羟基的分子产生的本征离子电导的新观点,建立了SP的高温导电模型,并对电性能测量结果作出了新的解释.

Conduction mechanism of solidified SP (polyster improved silicon paint)at high temperature is investigated via the measurement of resistivity of SP solidified by different technology at different temperatures,and via the analysis of its TGA,DTA and IR spectrum. Experimental results show that by certain solidifying technology SP has the highest resistivity, the lowest iontransportation and an optimal microstructure. The view that conduction of SP at high temperature mainly is the one of the intrinsic ionic which is caused by the molecules including hydroxyl group is put forward. And a new explanation for the electrical experimental results is provided success fully.