金刚石-金属复合薄膜的电沉积规律

The Electrodepositing Rule of Diamond - metal Composite Film

简要介绍了用电铸法制备金刚石-金属复合薄膜的方法,给出了薄膜的沉积规律,指出:电镀工艺参数如阴极电流密度、镀液中金刚石含量、搅拌等对沉积结果影响很大,而pH值、温度、阳阴极间距对沉积结果影响不很明显,重点给出了搅拌速度和位置对薄膜中金刚石含量分布的影响,搅拌速度太低金刚石颗粒分布不均匀,而搅拌速度太高则会引起沉积密度很低甚至无金刚石沉积,最佳搅拌速度范围为180 r／m-220 r／m,最佳搅拌位置在镀液下部。并从沉积机理的角度对所得结果作了简要分析。此外,采用扫描电镜(SEM)、X射线光电子谱(XPS)、X射线衍射(XRD)等检测手段研究了该薄膜显微结构。

The preparation method of electrodformed diamond - metal composite film was introduced , and the electrodepositing rule was analysed. It is indicated that processing parameters such as the electric current density of cathode, the content of diamond abrasive grains in electrolytic solution and the stirring condition affect the electrodepositing result greatly, while the effects of pH value, temperature and the distance between cathode and anode were not remarkable. It is found that the stirring velocity and position have great influence on the distribution of diamond abrasive grains. If the stirring relolity is too low, the distribufion of diamond grains would not be even. If it is too high, the density of diamond grains would be very low or there would be no diamond grains in the film. The optimum stirring velocity is 180 r/m - 220 r/m and the best stirring place is at the lower part of the electrolytic solution. Scanning electron microscope ( SEM) , X-ray photoemission spectroscopy ( XPS) , X-ray diffraction ( XRD) were used to measure the microstructure of the film.