摘要
MCM(多芯片模块)基板技术是MCM技术的一个重要组成部分。该文从基板的结构、性能以及材料等多个方面逐一对5种主要的 MCM基板技术进行了分析。并从封装和应用的角度对MCM基板技术作了相关说明。
MCM substrate technology is the main part of MCM technology. In this paper, five major kinds of MCM substrate technology are mainly analyzed in such respects as structure, performance, material, etc. At the same time, the additional discussion is carried out from the viewpoint of the MCM package and application.
出处
《计算机工程》
CAS
CSCD
北大核心
2004年第B12期473-474,535,共3页
Computer Engineering
关键词
MCM技术
基板技术
封装
Multichip module technology
Substrate technology
Package
