摘要
采用铸造方法制备了SiCp Al 10Si 0 5Mg、SiCp Al 5Si 0 5Mg复合材料,以常规透射电镜为主要分析手段,对复合材料中六方SiC颗粒上的台阶界面进行了研究。台阶界面产生于SiC颗粒上的局部区域。台阶上两个相交的小平面,其中之一是六方SiC晶体中的(0001)最密排面。台阶界面上增强体与基体结合良好。提出了台阶界面形成的两种机制。
SiCp/Al10Si05Mg and SiCp/Al5Si05Mg composites were fabricated by casting method. The stage interface of hexagonal SiC in composites was investigated by means of conventional TEM. The stage interface came from partial area of SiC particulate and one of the facets was always the closest packing crystal plane(0001). There was a good bonding between reinforcement and matrix on the stage interface. Two mechanisms were proposed for stage interface formation.
出处
《电子显微学报》
CAS
CSCD
北大核心
2003年第5期410-414,共5页
Journal of Chinese Electron Microscopy Society