摘要
在改性酸酐固化的环氧树脂体系中,加入非环氧类低粘度活性交联剂,得到了室温下粘度仅为80mPa·s的酸酐 环氧树脂体系。利用正交试验优选了树脂配方,该树脂体系在有效降低粘度的同时,还提高了耐热性,优选配方树脂体系的热变形温度达到265℃。该树脂体系适用于RTM(ResinTransferMolding)成型工艺制备高性能复合材料及电器设备的灌封。
In this paper,self-made active cross-linking agent with low viscosity was added to epoxy resin system which use modified anhydride as curing agent to decrease the viscosity of the resin composition to 80 mPa·s at room temperature.After optimizing the formula and curing conditions by orthogonal test,the resin system both had low viscosity and good heat resistance.Its heat distortion temperature reached to 265 ℃。So it was suit for making high performance composite by RTM method and encapsulating resin for electronic equipments.
出处
《热固性树脂》
CAS
CSCD
2005年第1期31-33,共3页
Thermosetting Resin
关键词
环氧树脂
酸酐
粘度
热变形温度
epoxy resin
anhydride
viscosity
heat distortion temperature
