摘要
介绍了在干氧和氢氧合成两种不同工艺和不同栅氧层厚度情况下,CMOS 运算放大器电路的电离辐照响应规律。并通过对其单管特性及内部单元电路辐照变化的分析比较,探讨了栅氧层厚度的变化与运放电路辐照损伤之间的相互依赖关系。结果显示,适当地减薄栅氧层厚度,可相应地减少辐照感生氧化物电荷和界面态引起的跨导衰降,从而使 CMOS 运放电路的抗辐射特性得到明显的改善。
By comparing the characteristic changes of transistors, subsidiary and entire circuits of CMOS amplifiers with different thickness of gate oxide layer, influence of the thickness of gate oxide layer on the op-amps' irradiation response was investigated. It was shown that by lessening the thickness of gate oxide layer properly, degradation of transconductance of the op-amps' transistors induced by radiation-generated oxide charges and interface states can be reduced, therefore, the ability of CMOS amp to resist radiation can be improved.
出处
《核技术》
EI
CAS
CSCD
北大核心
2005年第3期227-230,共4页
Nuclear Techniques
关键词
CMOS运算放大器
跨导
栅氧层
氧化物电荷
界面态
CMOS op-amp, Transconductance, Gate oxide layer, Oxide charges, Interface states