摘要
详细分析电路的检漏过程,剖析漏率测量和电路内部水气含量之间的关系。通过有针对性的预防措施,减小检漏过程对电路内部水气含量的影响,使电路内部的水气含量基本满足GJB548A要求。
The leak detection process is in detail analyzed, and relation between leak ration measurement and vapour content in circuit is discussed. The influence of leak detection process on vapour content in circuit is decreased by preventative measures to basically satisfy the requirement of GJB548A.
出处
《电子元器件应用》
2005年第2期1-2,60,共3页
Electronic Component & Device Applications
关键词
检漏
水气含量
气密封装
可靠性
leak detection
vapor content
capsulation package
reliability
