摘要
电子器件封装在近三四十年内获得巨大的发展,产生了质的变化,已经变成实现电子系统性能、质量、可靠性的关键环节之一。该文简要介绍了近三四十年来电子封装形成的演变及发展趋势,同时讨论了目前产业和研究领域的最新动态和热点问题。
In the past 30 to 40 years,Electronics Packaging undertook substantial development and change,and it became one of the key process to assure electronics application system performance,quality and reliability.This essay introduces the development procedure of electronics packaging and the cutting edge technology and headline topics in industry research field.
出处
《印制电路信息》
2005年第1期18-20,41,共4页
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