无铅焊接材料的趋势及问题

Development Tendency and Problem of Lead-free Solders

无论是环境的要求还是作为竞争的筹码,无铅钎料在表面组装领域中的应用已经是不可回避。然而无铅化仍然存在材料、工艺、设备、系统兼容等问题。在解决材料及电子产品可靠性的同时,无铅产品需要开创我国自己的品牌。

It is unavoidable that lead-free solders are applied in SMT field in view of the environmental protection and the competitive motivation. However, many problems such as materials selection, soldering process and device, system compatibility are still obsessing the development and application of lead-free solders. At the time of dealing with materials selection and product reliability, it is necessary to create our Chinese brands of the lead-free products with intellectual property rights.