某系统封装产品的热仿真分析

Thermal Simulation Analysis of a SIP

抗恶劣环境计算机是否能够承受温度冲击直接影响着产品的可靠性。为了确定某系统封装(SIP)产品在环境 温度急剧变化时的适应性,本文用ANSYS软件对该系统进行了计算机仿真,经过熟分析和热场-结构场耦合分析,找出了 最佳的耐温度冲击的设计方案。

Whether a severe environment computer can endure temperature shock affects directly the reliability of products. In order to confirm the adaptability of a SIP when the environment temperature changes sharply, this paper simulates the system with ANSYS. After the thermal analysis and the thermal field-structural field coupling analysis, the paper finds the optimal design method for resisting temperature shock.