摘要
以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。移动电话、薄型笔记本个人电脑(PC),数字视频摄像(DVC)以及从移动电话到信息终端的升级正在实现小型轻量化和多功能化。HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。全球性的环境意识正在加强,PWB业领域引入环境技术已成当务之急,现已开发了环境友好性的无卤/无SbHDI材料。
Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board(PWB)that make such high-density packaging possible are making greatly progress.Portable phone,thin notebook-type PCs,digital video cameras,as well as to up grading of portable phone to informance terminals are downsizing,weight reducing and function diversification.This development of build up-type multilayer PWB is supported by HDI materials' technology,as well as processing technology for fine-pitch circuit formation and fine-via formation. Amid stronger environmental conseiousness worldwide,introduction of environ mental technologies has become essential in PWB field.Now,environmentally-friendlly halogen-free HDI materials was developed.
出处
《印制电路信息》
2003年第2期16-21,共6页
Printed Circuit Information
