用于芯片级封装载板的绝缘材料

Advanced Dielectric Materials for Chip Package Substrates

电子产品向轻、薄、多功能及高频高速的方向发展对用于封装基般的绝缘材料提出了更高的要求,本文从材料 的电性能、力学性能、热性能以及与标准PCB制作工艺相容性等方面阐述了芯片级封装载板对绝缘材料的要求。

Driven by the needs for smaller,lighter,higher speed and HF of electonics,more needs are demanded to the dielectric materials for chip package subsrates. In the text,the needs were discussed from the following factors: electrial.thermal performance, mechanical and the ease of processing associated with standard PCB fabrication.