摘要
本文主要阐述了用传统方法生产埋/盲孔多层板的工艺中,应该注意的问题以及此工艺方法的适用性。
This paper has elaborated to should attention the matters for traditional process manufacture bury/blind via hole multilayer as well as the applicability of this process.
出处
《印制电路信息》
2003年第2期32-32,共1页
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