摘要
本文主要介绍了CPU芯片封装技术的发展演变,以及未来的芯片封装技术。同时,从中可以看出芯片技术与封 装技术相互促进,协调发展密不可分的关系。
The development of CPU chip package technology is introduced in the paper, the furture of package technology is also included. At the same time ,make out the close relation between IC chip and microelectronic package technology.
出处
《印制电路信息》
2003年第2期66-68,共3页
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