摘要
概述松下电子部品和目本一共同开发的ALIVH+vIL的新构造积层板,其特征是以ALIVH为基板(芯板), 以细线化的VIL为表面层,适用于21世纪的高密度安装。
This paper summarizes the new structure build-up board-ALIVH+VIL developed by Panasonic and victor.It is characterized by using ALIVH as base board(core board) and using fine pattern VIL as surface layer.It is suitable to high-density mounting for 21th century.
出处
《印制电路信息》
2003年第3期24-28,共5页
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