期刊文献+

埋入电容印制板工艺技术 被引量:1

The Craft Technology of Buried Capacitance PCB
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摘要 本篇文章讨论的是采用两种基材制作四层埋入电容印制板的方法FR-4基材和FR-406电容材料分别经过单面 图形转移,再经层压到外层制作的路线完成此四层板尺寸变化较小,能够很好地配合高层数多层板的工艺制作。 In this paper, we discuss an innovated technology of embedding capacitance in PWB by using two kind of laminares. Firstly we etch single-sided pattern with FR-4 and FR-406, then laminate the two materials, finally fabricate the outlayer patterns. This method has not only a better dimensional consistence than other ways, but it could be very compatible with super multilayer pcb technology.
作者 陈岩
出处 《印制电路信息》 2003年第3期66-68,共3页 Printed Circuit Information
关键词 埋入电容 印制电路板 FR-4基材 FR-406电容材料 图形转移 工艺制作 多层板 embedded capacitance PCB technology single-sided pattern transfering
  • 相关文献

参考文献5

  • 1The Buried Capacitance Design Guide. SANMINA Corporation Printed in the United States of America .1995
  • 2Embedded Passives Technology for PCBs: Materials, Design,and Process By Jiming Zhou, John D. Myers, Delphi Delco Electronics Systems, and John J. Felten DuPont i-Technologies
  • 3蔡积庆.埋入无源元件的印制板[J].印制电路信息,2001(10):26-31. 被引量:2
  • 4白蓉生.内嵌式电容器之发展[J].印制电路信息,2002,10(1):38-46. 被引量:3
  • 5Acitor Selection and EMI Filtering Jeffrey Cain and Steve Makl, AVX Corporation, Myrtle Beach, SC

二级参考文献28

  • 1Embedded Passive Components in PCB, by W.I.Borland and S.Ferguson(Dupont),Circuitree, Mar.2001
  • 2An Improved Laminate for Embedded Capacitance Application, by J.Gotro and J.Kamla(Isola);IPC 1999 Proceedings(S04-3)
  • 3Developments of PI Based Capacitors and Resistors for Integral Passives, by G.Min,S.Fang、and Y.L.Lee(Dupont), IPC 2000 Proceedings
  • 4Impedance and EMC Data of Embedded Capacitance Materials, by I.Novak/Sun Microsyotens, IPC 2001 Apex Proceedings (AT3)
  • 5Development of High Dk Polyimide System for Integral Passives, by G.Min,M.Katz,and Y.L.Lee(Dupont); IPC 1998 Proceedings (S04)
  • 6Fabrication of Embedded Capacitance PCB,by J.S.Peiffer(3M);IPC 2001 Proceedings (S08-3)
  • 7NEMI Technology Roadmaps(Dec.2000),the section of Passive Components.
  • 8Design Guidelines for PCB with Em bedded Capacitance (NCMS Report), by T.Hubing and M.Xu/niveroity of Mis souri-Rolla (2000.6.1)
  • 9An Overview of the NCMC' s Embed ded Capacitance Project,2000.6.22
  • 10Enbedded Ceramic Resistors and Ca pacitors for PWB.by J.Felten and S.Ferguson(Dupont iTech),IPC 2000 Proceedings(S08-5)

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