无卤/无铅积层板B^(2)it^(TM)

Halogen Free/Pb Free Build-up Board B^(2)it^(TM)

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摘要概述了应用新芯印刷工艺和一次性层压工艺的无卤/无Pb积层板B2itTM三种制造工艺,评价了无卤/无Pb积层板B2itTM的长期可靠性和无Pb再流焊特性。 This paper summarizes three types manufacturing process of halogen free/Pb free build-up board B2it?using new core printing process and single step press process,evaluating long term reliability and Pb free reflow characteritics of halogen free/Pb free build-up board B2it?

作者蔡积庆

机构地区南京无线电八厂

出处《印制电路信息》 2003年第9期52-57,共6页 Printed Circuit Information

关键词无卤/无Pb 积层板B^(2)it^(TM) 新芯印刷工艺一次性层压工艺 Halogen free/Pb free build-up board B^(2)it^(TM) new core printing process single step press process

分类号 TN41 [电子电信—微电子学与固体电子学]

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1Y.Sato,K.Shibayama,H.Hamano and Y.Fukuoka. A New PCB Utilizing Buried Bump Interconnection Technology(B2itTM).Proc.7th Printed Circuit Word Convention,May,1996
2Y.Fukuoka,T.Oguma and Y.Tahara. New High Density Substrate with Buried Bump Interconnection Technology(B2itTM)Design Features of Electrical and Thermal Performance with the Actual Applications-Proc.1998 International Symposium on Microelectronics(IMAPS),Now. 1998,San Diego:405～412
3K.Goto,T.Oguma and Y.Fukuoka. High Density Printed Circuit Board Using B2itTM Technology, IEEE Transaction Vol,23,No3,Aug,2000:447-451
4福冈义孝.ハロワンフリ-Pbフリ-对芯ピルトグ配线板"B2itTM".电子技术,2000.6别册

1杨维生.一次性层压制造埋／盲孔多层印制板技术研究[J].电子电路与贴装,2005(2):1-8.
2蔡积庆.一次性层压的多层板—PALAP基板[J].印制电路信息,2003(3):29-32.

印制电路信息

2003年第9期

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无卤/无铅积层板B^(2)it^(TM)

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