从日本专利看PCB基板材料制造技术的新发展之一——构成PCB绝缘层用树脂薄膜

Thin Resin Films Laminated in PCB Insulating Layer——The Newest Development of Manufacturing Technology about PCB Substrate According to Japanese Patent (Ⅰ)

以近一两年发表的日本专利为对象,研究、综述了日本PCB基板材料业在制造技术上的新发展。本篇主要围绕着有关构成PCB绝缘层用树脂薄膜制造技术的主题。

The newest development of manufacturing technology about PCB substrate was reviewed according to Japanese patent in recent two years in the serial paper. The article had summarized mostly thin resin films laminated in PCB insulating layer.