摘要
概述了埋入无源元件陶瓷基板,集成无源元件(IPD)硅基板,埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。它适应于21世纪安装技术的革新。
This paper is describes the technology trend of passive component embedded ceramic substrate, integrated passive device(IPD)Si substrate, passive Component embedded or passive and active component embedded resin substrate. It is suitable to revolutionization of mounting technology in 21th century.
出处
《印制电路信息》
2003年第10期44-48,64,共6页
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