摘要
哪种方式更能提高LST的附加值?是SiP(system in a package)还是SoC(system on a chip)?LSI厂家正对此进行激烈争论。作为系统集成的选择方式,LSI厂家一直集中力量致力于SoC的开发。但是LSI厂家发现,仅靠SoC这一条路线已不能满足用户的要求。目前,对于各大LSI厂家来说,要不要转换其发展资源的投入方向,需要当机立断。
Which will be stronger for enbancing the added value of LSIs, SiP(system in a package)or SoC(system on a chip)?LSI makers are in the middle of this hot argument this is because both approaches have become rivals for the one choice of system integration technology, Up until now,LSI makers have been giving first priority to SoC development but makers have found it impossible to meet users' demands by only depending on SoC technology. On the other hand, the SiP technology has emerged rapidly in place of SoC as a means for realizing single-package integration. Every LSI maker is going to be forced to decide to change the way in which it invests its development resources.
出处
《印制电路信息》
2003年第12期3-13,共11页
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